HY485 epoxy resin Potting glue
HY485 toughened epoxy adhesive is a two-component, self-leveling, fast curing epoxy resin potting material at room temperature. It has excellent aging resistance, moisture resistance, electrical insulation, elastic shock resistance and high breakdown voltage.
Product details
Application
1. Used for electronic components such as transformers, coils, magnetic cores, etc. 2. Bonding and fixing of metals, ceramics, plastics, rubber, glass, fiber products, handicrafts, gems, etc. 3. Various repair potting, etc.
Specification
| Model | HY485T | HY485B |
| Appearance and color | Transparent | Gray-black |
| Viscosity (Pa•s, 23℃) | 15~50 | 25~60 |
| Density (g/cm3) | 1.05±0.2 | 1.5±0.2 |
| Volume ratio (A:B) | 1:1 | 1:1 |
| Operation time (min, 23℃) | 5 | 5 |
| Tack-free time (min, 23℃) | 10~15 | 10~15 |
| Shore hardness (S.D) | 75~85 | 75~85 |
| Shear strength (MPa) | 15~25 | 15~25 |
| Elongation (%) | 5~20 | 5~20 |
| Flame retardant grade (UL94) | HB | 0 |
| Operating temperature range (℃) | -50~120 | -50~120 |
Product Features
1. 1:1 ratio, easy to use 2. Solvent-free, non-corrosive, environmentally friendly and low-carbon 3. Fast curing in 10 minutes, non-smoke gel, flexible 4. It has insulation, moisture-proof, anti-vibration and flame-retardant properties.
