HY568Hemming epoxy glue for automobiles
HY568 is a one-component modified epoxy resin adhesive, referred to as epoxy folding adhesive, with 100% solid content, no solvent, no isocyanate, and no flow when cured by heating. It has excellent oil resistance, water resistance, acid and alkali resistance, chemical resistance, good corrosion resistance, and good heat resistance and moisture resistance.
Product details
HY568 is a one-component modified epoxy resin adhesive, referred to as epoxy folding adhesive, with 100% solid content, no solvent, no isocyanate, and no flow when cured by heating. It has excellent oil resistance, water resistance, acid and alkali resistance, chemical resistance, good corrosion resistance, and good heat resistance and moisture resistance. It can be used for the folding of the inner and outer panels of the car door, the joint of the cab floor, the top cover of the cab, the trunk cover, the side wall, the wheel cover, the engine cover and other folding parts, which can play the role of bonding, sealing, shock absorption, and anti-corrosion. This product meets environmental protection requirements, does not contain harmful substances in GB18583 "Limits of Hazardous Substances in Adhesives for Interior Decoration Materials", meets the EU ROHS and REACH environmental protection standards, and meets the German environmental protection standards for automotive adhesives.
Curing Mechanism
HY568 epoxy folding adhesive, curing method is heating curing. The higher the temperature, the faster the curing; the general heating temperature is 160~180℃ for about 30 minutes, and the maximum heating temperature is 220℃ for 30 minutes. The customer can decide according to the actual operation process.
Packaging specification
400ml/group; 20kg/set
Curing Mechanism
HY568 epoxy folding adhesive, curing method is heating curing. The higher the temperature, the faster the curing; the general heating temperature is 160~180℃ for about 30 minutes, and the maximum heating temperature is 220℃ for 30 minutes. The customer can decide according to the actual operation process.
Main chemical composition | Modified epoxy adhesive | |
Rubber appearance | Homogeneous paste, no particle agglomeration, no bubbles | |
Density (g/cm3) | 1.4±0.1 | |
Sag (mm) | ≤2 | |
Pressure flow viscosity (g/min) | 30~70 | |
Non-volatile matter (%) | ≥98 | |
Curing conditions (160℃, 30min) | Fully cured | |
Tensile shear strength MPa | 23℃ | ≥16 |
-40℃ | ≥16 | |
80℃ | ≥7 | |
Heat aging | ≥15 | |
Overbake resistance | ≥15 | |
Alternating resistance to cold and heat | ≥15 | |
Water resistance | ≥15 | |
Salt spray resistance test | ≥15 | |
Tear strength (N/25mm) | ≥50 | |
Cured appearance | The surface of the adhesive layer is not sticky, no cracks and bubbles, dense and no bubbles |
Packaging specification
400ml/group; 20kg/set