HY592Silicone potting compound for electronic appliances

Silicone encapsulant is a one-component room temperature curing silicone material, low viscosity, self-leveling, and an elastomer after curing. High and low temperature resistance, excellent aging resistance, flexibility, insulation, moisture resistance, shock resistance, corona resistance and leakage resistance. It is suitable for potting protection of small or thin layers (potting thickness less than 7mm) of electronic components, circuit boards, sensors, relays, etc.

09-02-2023