HY592Silicone potting compound for electronic appliances
Silicone encapsulant is a one-component room temperature curing silicone material, low viscosity, self-leveling, and an elastomer after curing. High and low temperature resistance, excellent aging resistance, flexibility, insulation, moisture resistance, shock resistance, corona resistance and leakage resistance. It is suitable for potting protection of small or thin layers (potting thickness less than 7mm) of electronic components, circuit boards, sensors, relays, etc.
Product details
HY592T: De-oxime type, transparent, potting of various electronic components.
HY592B: De-oxime type, black, potting of light-emitting diodes and other electronic components.
HY592W: De-oxime type, white, potting of electrical modules and other electronic components.
HY582: Dealcoholized type, transparent, non-corrosive to polycarbonate (PC), copper and other materials, potting of various electronic components.
| Performance | HY592T | HY592B | HY592W | HY582 |
| Exterior color | Transparent fluid | Black fluid | White fluid | Transparent fluid |
| Viscosity (Pa•s) | 6~10 | 8~12 | 6~10 | |
| Density (g/cm3) | 0.9~1.3 | |||
| Surface drying time (min) | 10~40 | 5~25 | ||
| Tensile strength (MPa) | ≥0.5 | ≥0.8 | ≥0.5 | |
| Extension rate (%) | 100~200 | 200~300 | 100~200 | |
| Shore Hardness (Shore A) | 15~25 | 20~30 | 15~25 | |
| Shear strength (MPa) | ≥0.5 | |||
| Dielectric strength (kv/mm) | ≥15 | |||
| Volume resistance (Ω•cm) | 1×1014 | |||
| Working temperature range (℃) | -60～250 | |||
| Packing specification | 100ml/pcs, 100pcs/carton; 310ml/tube, 50tubes/carton | |||
