HY584Electronic potting glue
silicone potting sealant is a two-component, room temperature curing, condensation and dealcoholization type of silicone potting material. Self-leveling, high and low temperature resistance, excellent aging resistance, insulation, moisture resistance and shock resistance. Used in various bonding and sealing of electronic components.
Product details
Product Features
1. Solvent-free, environmentally friendly and low-carbon
2. Excellent weather resistance, aging resistance, UV resistance
3. It is insulation, moisture-proof, shock- resistance
4. Suitable for potting and sealing of electronic components
5. Non-corrosive
Main Applications
HY5850 silicone gel is suitable for sealing and protecting various electronic components, especially precision electronic
components.
HY585T is suitable for potting and sealing of electronic components with transparency requirements.
HY584D is suitable for various potting and sealing of electronic components that have thermal conductivity and flame retardant requirements.
HY584H is suitable for potting and sealing of electronic components with high thermal conductivity requirements.
Curing Mechanism
HY584 is a silicone potting material. Its curing mechanism is to react and cure with a curing agent to become an elastic solid. The higher the temperature and the higher the humidity, the faster the curing, the curing speed would be the slower in the low temperature and low humidity environment
Specification
Product Features
1. Solvent-free, environmentally friendly and low-carbon. 2. Excellent weather resistance, aging resistance, UV resistance. 3. It is insulating, moisture-proof and shock-proof. 4. Non-corrosive, fast curing.
Packaging specification
1. Solvent-free, environmentally friendly and low-carbon
2. Excellent weather resistance, aging resistance, UV resistance
3. It is insulation, moisture-proof, shock- resistance
4. Suitable for potting and sealing of electronic components
5. Non-corrosive
Main Applications
HY5850 silicone gel is suitable for sealing and protecting various electronic components, especially precision electronic
components.
HY585T is suitable for potting and sealing of electronic components with transparency requirements.
HY584D is suitable for various potting and sealing of electronic components that have thermal conductivity and flame retardant requirements.
HY584H is suitable for potting and sealing of electronic components with high thermal conductivity requirements.
Curing Mechanism
HY584 is a silicone potting material. Its curing mechanism is to react and cure with a curing agent to become an elastic solid. The higher the temperature and the higher the humidity, the faster the curing, the curing speed would be the slower in the low temperature and low humidity environment
Specification
| item | value |
| CAS No. | 67763-03-5 |
| Other Names | RTV-2 silicone encapsulation Sealant |
| EINECS No. | 200-902-6 |
| Place of Origin | China |
| Henan | |
| Classification | Double Components Adhesives |
| Main Raw Material | Silicone |
| Usage | Solar & PV module |
| Brand Name | JIAGU |
| Model Number | HY584 |
| Type | Two-Component |
| Compound color A/B | White/ Transparent |
| A/B proportion | 10:1 |
| Density (g/cm3) A/B | 1.2/1.03 |
| viscosity (Pa.S) A/B | 4.5~7.5/0.4~0.5 |
| Shore hardness (Shore A) | 20~50 |
| Applicable temperature (℃) | -60~200 |
| Thermal conductivity (W/m•k) | 0.6 |
| Dielectric strength (kv/mm) | ≥20 |
| Application | Solar & PV module |
| Complete curing time(h) | 2~4 |
Product Features
1. Solvent-free, environmentally friendly and low-carbon. 2. Excellent weather resistance, aging resistance, UV resistance. 3. It is insulating, moisture-proof and shock-proof. 4. Non-corrosive, fast curing.
Packaging specification
| A component packed in 10kg/barrel. Barrel mouth diameter: 270mm, height 295mm. | B component packed in 1kg/plastic bottle.14 bottle/carton. Safety and health |
| Number of whole pieces： | 14 bottle/carton |
